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Phiar Gets DARPA Grant



Boulder, Colorado-based Phiar, a developer of metal-insulator electronic devices, said today that it has received a Phase-II SBIR contract from the Defense Advanced Research Projects Agency (DARPA). The $1.4M grant was made through DARPA's Microsystems Technology Office. The grant will fund work on novel metal-insulator transistor development. The work is expected to provide technology for transistors that can reach frequencies of 3 terahertz. Phiar is a spinoff of the University of Colorado and has venture funding from Menlo ventures.


 

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