Boise, Idaho-based Micron yesterday announced a new line of multichip package memory for use in mobile phones. The company said that its new memory is specifically designed for 2.5G and 3G handsets, and combines NAND flash memory with mobile DRAM in the same package. The new line targets high density, small form factor, and low power mobile devices. The new memory will be available in 1Gb NAND/512Mb DDR in Q4 of this year.
Top NewsThursday, February 2, 2006
Micron Launches Memory for Mobile Phones