Friday, June 30, 2006
FlipChip Promotes Executives
Phoenix, Arizona-based FlipChip International, a provider of semiconductor wafer scale packaging, has promoted two of its executives. The company said this week that it has appointed Jay Grover as Chief Operating Officer, and named Ted Tessier as Chief Technical Officer of the firm. Grover was most recently VP of Operations for the firm. FlipChip provides products for the wafer bumping and wafer scale packaging semiconductor industry.