FlipChip International LLC, a supplier of products and services for the wafer scale packaging and bumping semiconductor market, reported earlier this week that it has hired Scott T. Barrett as vice president of Asian business development for the company’s operations in Phoenix and for its FCMS joint venture in Shanghai, China. An Intel veteran, Barrett joined Flip Chip Technologies in 1998 and rose to the position of divisional general manager before the company’s sale in 2004. Barrett then joined Kulicke & Soffa Industries as director of strategic marketing before returning to FlipChip. In his new role, Barrett will oversee sales, marketing and licensing for FlipChip's Asian operations. He'll also supervise the company’s photovoltaic packaging services.