Phoenix, Arizona-based FlipChip International said earlier this week that it has introduced a new technology focused on allowing integration of circuits into 3D packaging. 3D packaging is an effort by electronics manufacturers to further integrate semiconductors into smaller footprints. According to FlipChip, its new Embedded Die Customization (EDC) technology will allow semiconductor devices to be embedded within printed circuit boards, which is expected to reduce the size of circuits for things like cellular phones. The firm said the service is being developed at its facility in Phoenix. The firm said it expects products using 3D packaging solutions to be available in the next 2 to 3 years.